EGchip
Contact Us
  1. Home
  2. Categories
  3. Connectors, Interconnects Recycling
  4. Sockets for ICs, Transistors
Number of Positions or Pins (Grid) :
More
Applied Filters :
13 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
22-4513-11
Per Unit
$2.34
RFQ
51,500
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
22-4513-10
Per Unit
$1.48
RFQ
36,340
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
08-4513-11H
Per Unit
$1.47
RFQ
55,860
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 8POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
22-4513-10T
Per Unit
$1.33
RFQ
37,280
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
22-4513-11H
Per Unit
$3.61
RFQ
74,880
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
02-4513-10
Per Unit
$0.17
RFQ
14,580
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 2POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
22-4513-10H
Per Unit
$2.82
RFQ
16,380
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
12-4513-10
Per Unit
$0.94
RFQ
40,320
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 12POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (2 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
08-4513-11
Per Unit
$0.93
RFQ
38,000
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 8POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
10-4513-11H
10-4513-11H
Per Unit
$1.80
RFQ
42,340
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
08-4513-10
08-4513-10
Per Unit
$0.88
RFQ
77,100
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 8POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
08-4513-10T
Per Unit
$0.48
RFQ
77,820
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 8POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
08-4513-10H
Per Unit
$1.15
RFQ
70,640
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET 8POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
Page 1 / 1
Prev Next
517766973
+86 755 25433961
evergreen@egchip.com
luoweiadam
Send Message
EGchip's Ambition:

Make the world evergreen by recycling IC Chips,
Semi & E-assets with higher price!

© 2008-2021 egchip.com all rights reserved.
Tel: +86 755 25433961    Email: evergreen@egchip.com