- Mounting Type :
- Features :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
3 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
50,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET BGA 456POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 456 (26 x 26) | Beryllium Copper | - | Brass | |||
|
|
|
19,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET BGA 456POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 456 (26 x 26) | Beryllium Copper | - | Brass | |||
|
|
|
65,520
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 456 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
