38 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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44,680
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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63,900
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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76,440
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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75,100
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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20,280
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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60,160
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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29,660
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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60,680
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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42,200
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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31,100
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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35,100
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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56,540
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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22,860
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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48,780
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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21,960
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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37,800
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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76,520
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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35,640
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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60,120
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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24,940
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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72,780
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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55,760
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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16,280
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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25,900
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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58,960
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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29,520
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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79,280
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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66,380
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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38,080
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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30,160
One step to sell excess stocks.Or submit Qty to get quotes
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
