Contact Finish - Mating :
Contact Material - Post :
142 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
Default Photo
Per Unit
$17.34
RFQ
18,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
14,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
25,720
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
18,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
59,920
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
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RFQ
43,660
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
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RFQ
68,800
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
Per Unit
$31.84
RFQ
74,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$14.79
RFQ
79,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$14.58
RFQ
35,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$17.59
RFQ
48,440
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$17.59
RFQ
38,940
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
79,540
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
22,560
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
70,580
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
71,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
75,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
35,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
29,480
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
73,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$15.30
RFQ
76,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$15.30
RFQ
55,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$15.30
RFQ
70,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
GET PRICE
RFQ
35,540
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
GET PRICE
RFQ
41,740
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
Per Unit
$46.05
RFQ
50,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$44.40
RFQ
16,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$7.50
RFQ
66,040
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
Per Unit
$7.20
RFQ
70,060
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
Per Unit
$19.04
RFQ
35,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
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