- Part Status :
- Packaging :
- Operating Temperature :
- Mounting Type :
- Features :
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (2)
- Polyamide (PA46), Nylon 4/6, Glass Filled (1)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (6)
- Polyester, Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (28)
- Thermoplastic (1)
- Thermoplastic, Polyester (1)
- Thermoplastic, Polyester, Glass Filled (1)
- Contact Finish Thickness - Mating :
- Contact Material - Post :
42 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
29,100
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
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74,140
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
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79,820
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
GET PRICE |
67,780
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | ||
|
|
|
22,560
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
70,580
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
76,260
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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55,400
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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70,320
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
50,880
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
16,960
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
52,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
19,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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32,140
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
13,360
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
40,680
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
|
64,520
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
65,320
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
61,740
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
26,360
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
54,760
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
67,120
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
64,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
69,660
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | 32 (2 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
|
61,560
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | - | Copper | |||
|
|
|
62,700
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | - | Nickel | |||
|
|
|
63,920
One step to sell excess stocks.Or submit Qty to get quotes
|
Samtec Inc. | CONN IC DIP SOCKET 32POS TIN | iCF | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
63,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Samtec Inc. | CONN IC DIP SOCKET 32POS TIN | iCF | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | |||
|
|
43,320
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
53,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 32POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |
