- Manufacture :
- Operating Temperature :
- Mounting Type :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Post :
6 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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54,280
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
|
33,660
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
51,420
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
25,380
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
58,500
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
|
79,900
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |