- Operating Temperature :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Post :
20 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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24,080
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
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71,700
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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54,720
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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21,760
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 111 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
61,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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61,500
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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19,200
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
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37,420
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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31,860
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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17,820
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
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40,960
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
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28,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
55,400
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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13,520
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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47,280
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
67,360
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
57,320
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
44,640
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
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16,420
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 4POS TIN-LEAD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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46,900
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 4POS TIN | - | Active | Bulk | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper |
