Sockets for ICs, Transistors - EGchip

Applied Filters :

8 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
	42-6553-16	Per Unit $22.37		PDF RFQ	24,280 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper
	42-6552-16	Per Unit $22.37		PDF RFQ	47,900 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper
	42-6551-16	Per Unit $22.37		PDF RFQ	57,640 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper
	42-3553-16	Per Unit $22.37		PDF RFQ	31,720 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper
	42-3552-16	Per Unit $22.37		PDF RFQ	46,200 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper
	42-3551-16	Per Unit $22.37		PDF RFQ	66,280 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper
	42-6554-16	Per Unit $24.57		PDF RFQ	23,900 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper
	42-3554-16	Per Unit $24.57		PDF RFQ	44,300 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	42 (2 x 21)	Beryllium Copper

Page 1 / 1

EGchip's Ambition:

Make the world evergreen by recycling IC Chips,
Semi & E-assets with higher price!

How to Buy

Delivery

Payment Terms

Electronic Components Recycling