4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
34,540
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Amphenol FCI CONN SOCKET SIP 3POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
79,080
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN SOCKET SIP 3POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
37,220
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Amphenol FCI CONN SOCKET SIP 3POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$0.24
RFQ
72,540
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN SOCKET SIP 3POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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