Contact Finish - Post :
Contact Finish Thickness - Post :
107 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
74,060
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 36 (2 x 18) Beryllium Copper - Brass
Default Photo
Per Unit
$10.08
RFQ
22,020
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$10.08
RFQ
71,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$10.08
RFQ
25,080
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$10.08
RFQ
53,660
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$10.08
RFQ
29,200
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
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RFQ
56,800
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 36 (2 x 18) Beryllium Copper - Brass
Default Photo
Per Unit
$7.73
RFQ
73,400
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$8.47
RFQ
19,420
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$8.43
RFQ
26,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$8.43
RFQ
47,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$8.43
RFQ
68,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$7.21
RFQ
12,640
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$7.21
RFQ
62,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$7.21
RFQ
74,940
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$7.21
RFQ
31,440
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 36POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$7.75
RFQ
71,740
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$7.58
RFQ
39,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$7.58
RFQ
35,360
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$7.58
RFQ
60,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$7.58
RFQ
60,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
110-13-636-41-001000
Per Unit
$7.61
RFQ
49,300
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (2 x 18) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
Per Unit
$5.71
RFQ
67,000
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - Gold 36 (2 x 18) Beryllium Copper - Beryllium Copper
Default Photo
Per Unit
$5.70
RFQ
76,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.68
RFQ
22,380
One step to sell excess stocks.Or submit Qty to get quotes
TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 36 (2 x 18) Beryllium Copper 25.0µin (0.63µm) Copper
Default Photo
Per Unit
$6.95
RFQ
21,240
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
Per Unit
$6.93
RFQ
69,240
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
714-43-236-31-018000
Per Unit
$4.24
RFQ
63,360
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (2 x 18) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
116-87-636-41-013101
Per Unit
$3.35
RFQ
75,800
One step to sell excess stocks.Or submit Qty to get quotes
Preci-Dip CONN IC DIP SOCKET 36POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 36 (2 x 18) Beryllium Copper - Brass
Default Photo
Per Unit
$8.31
RFQ
59,480
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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