Sockets for ICs, Transistors - EGchip

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14 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	36-6554-11	Per Unit $8.43		PDF RFQ	26,160 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	36-3554-11	Per Unit $8.43		PDF RFQ	47,520 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	36-3552-11	Per Unit $8.43		PDF RFQ	68,680 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	36-6552-11	Per Unit $7.58		PDF RFQ	39,420 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	36-6551-11	Per Unit $7.58		PDF RFQ	35,360 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	36-3553-11	Per Unit $7.58		PDF RFQ	60,860 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	36-3551-11	Per Unit $7.58		PDF RFQ	60,140 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	36-6553-10	Per Unit $5.71		PDF RFQ	67,000 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 36POS GLD	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	Gold	36 (2 x 18)	Beryllium Copper	-	Beryllium Copper
	612-83-636-41-001101	Per Unit $1.41		PDF RFQ	46,340 One step to sell excess stocks.Or submit Qty to get quotes	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD	612	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Carrier, Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	614-83-636-41-001101	Per Unit $1.38		PDF RFQ	49,460 One step to sell excess stocks.Or submit Qty to get quotes	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD	614	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Carrier, Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	614-83-636-31-012101	Per Unit $1.58		PDF RFQ	63,480 One step to sell excess stocks.Or submit Qty to get quotes	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD	614	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Carrier, Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	614-87-636-41-001101	Per Unit $0.94		PDF RFQ	49,700 One step to sell excess stocks.Or submit Qty to get quotes	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD	614	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Carrier, Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	612-87-636-41-001101	Per Unit $0.90		PDF RFQ	19,260 One step to sell excess stocks.Or submit Qty to get quotes	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD	612	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Carrier, Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	614-87-636-31-012101	Per Unit $1.18		PDF RFQ	75,240 One step to sell excess stocks.Or submit Qty to get quotes	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD	614	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Carrier, Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass

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Electronic Components Recycling