4 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
12,900
One step to sell excess stocks.Or submit Qty to get quotes
Amphenol FCI CONN SOCKET SIP 2POS TIN - Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame SIP Polyamide (PA), Nylon 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$10.90
RFQ
55,500
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Aries Electronics CONN SOCKET PGA ZIF GOLD - Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$0.52
RFQ
31,820
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components SOCKET 20 CONTACTS SINGLE ROW - Active - -40°C ~ 105°C Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
0804MC
Per Unit
$13.21
RFQ
13,140
One step to sell excess stocks.Or submit Qty to get quotes
Texas Instruments CONN TRANSIST TO-3 8POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Gold 30.0µin (0.76µm) Tin 8 (Oval) Beryllium Copper 200.0µin (5.08µm) Brass
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