3 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$10.90
RFQ
55,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA ZIF GOLD - Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$0.63
RFQ
46,900
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 4POS TIN - Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - Tin 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
0804MC
Per Unit
$13.21
RFQ
13,140
One step to sell excess stocks.Or submit Qty to get quotes
Texas Instruments CONN TRANSIST TO-3 8POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Gold 30.0µin (0.76µm) Tin 8 (Oval) Beryllium Copper 200.0µin (5.08µm) Brass
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