40 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
19,720
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$8.52
RFQ
14,060
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$2.40
RFQ
31,180
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.18
RFQ
52,960
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.49
RFQ
27,920
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.33
RFQ
35,000
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$0.83
RFQ
60,780
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.76
RFQ
30,960
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.76
RFQ
66,500
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.56
RFQ
62,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.56
RFQ
47,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.56
RFQ
13,880
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.56
RFQ
49,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.56
RFQ
68,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.56
RFQ
37,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.56
RFQ
51,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.97
RFQ
47,360
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.97
RFQ
73,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.59
RFQ
15,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.45
RFQ
67,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.69
RFQ
14,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.69
RFQ
64,280
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
14-810-90C
Per Unit
$4.55
RFQ
64,580
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
14-3518-101
Per Unit
$2.35
RFQ
40,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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Per Unit
$1.56
RFQ
43,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.55
RFQ
33,620
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS TIN EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.94
RFQ
21,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.72
RFQ
57,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
14-C280-10
Per Unit
$1.72
RFQ
79,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.85
RFQ
58,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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