Number of Positions or Pins (Grid) :
Contact Material - Mating :
877 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
76,840
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TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 15.0µin (0.38µm) Copper Alloy
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RFQ
77,160
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TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 15.0µin (0.38µm) Copper Alloy
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RFQ
52,020
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TE Connectivity AMP Connectors CONN SOCKET PGA 168POS GOLD - Obsolete Bulk - Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 168 (17 x 17) Beryllium Copper 30.0µin (0.76µm) Brass
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RFQ
55,000
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 10POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - Tin-Lead 10 (Round) Beryllium Copper - Brass
2134146-3
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RFQ
62,020
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TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Cut Tape (CT) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
2134146-3
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RFQ
41,960
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TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Tape & Reel (TR) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
2134146-2
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RFQ
47,040
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TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Cut Tape (CT) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
2134146-2
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RFQ
52,420
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TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Tape & Reel (TR) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy Flash Copper Alloy
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RFQ
23,640
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold Flash Tin-Lead 18 (2 x 9) Copper Alloy 80.0µin (2.03µm) Copper Alloy
2-382468-4
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RFQ
56,020
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 40 (2 x 20) Phosphor Bronze - Phosphor Bronze
2-382189-2
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RFQ
50,780
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper - Beryllium Copper
5-1437530-2
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RFQ
38,660
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TE Connectivity AMP Connectors CONN IC SIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder - SIP Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (1 x 8) Beryllium Copper - Brass
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Per Unit
$63.55
RFQ
76,560
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 3POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 3 (1 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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RFQ
27,460
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
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RFQ
14,540
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 123 Obsolete Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-422-41-801000
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RFQ
21,660
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$14.39
RFQ
63,400
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TE Connectivity AMP Connectors CONN SOCKET PGA 241POS GOLD PKA Active Bulk - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 241 (18 x 18) Copper Alloy 118.1µin (3.00µm) Phosphor Bronze
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Per Unit
$18.40
RFQ
69,840
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Brass 200.0µin (5.08µm) Brass
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Per Unit
$21.29
RFQ
54,760
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 48 (2 x 24) Brass 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$11.22
RFQ
15,000
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$11.22
RFQ
19,900
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$20.70
RFQ
27,180
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Brass 200.0µin (5.08µm) Brass
123-93-950-41-001000
Per Unit
$11.11
RFQ
75,380
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$11.08
RFQ
48,600
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-93-318-41-801000
Per Unit
$10.10
RFQ
42,480
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-93-668-41-005000
Per Unit
$10.05
RFQ
37,760
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 68POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 68 (2 x 34) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$17.98
RFQ
25,640
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Aries Electronics CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 24 (2 x 12) Brass 200.0µin (5.08µm) Brass
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Per Unit
$10.00
RFQ
49,000
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$9.96
RFQ
28,580
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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Per Unit
$9.96
RFQ
71,160
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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