Sockets for ICs, Transistors - EGchip

Applied Filters :

6 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	20-3513-10H	Per Unit $2.56		PDF RFQ	60,880 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	20 (2 x 10)	Beryllium Copper	200.0µin (5.08µm)	Brass
	20-3513-10T	Per Unit $1.05		PDF RFQ	72,840 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	20 (2 x 10)	Beryllium Copper	200.0µin (5.08µm)	Brass
	20-3513-11H	Per Unit $3.03		PDF RFQ	58,760 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	20 (2 x 10)	Beryllium Copper	10.0µin (0.25µm)	Brass
	20-3513-00	Per Unit $2.10		PDF RFQ	14,560 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	20 (2 x 10)	Beryllium Copper	200.0µin (5.08µm)	Brass
	20-3513-11	Per Unit $2.04		PDF RFQ	36,240 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	20 (2 x 10)	Beryllium Copper	10.0µin (0.25µm)	Brass
	20-3513-10	Per Unit $1.31		PDF RFQ	64,200 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	20 (2 x 10)	Beryllium Copper	200.0µin (5.08µm)	Brass

Page 1 / 1

EGchip's Ambition:

Make the world evergreen by recycling IC Chips,
Semi & E-assets with higher price!

How to Buy

Delivery

Payment Terms

Electronic Components Recycling