Sockets for ICs, Transistors - EGchip

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4 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
	20-822-90	Per Unit $4.80		PDF RFQ	33,640 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Phosphor Bronze
	20-820-90	Per Unit $4.80		PDF RFQ	27,020 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Phosphor Bronze
	20-810-90	Per Unit $6.59		PDF RFQ	79,200 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Vertical	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Phosphor Bronze
	20-823-90	Per Unit $5.26		PDF RFQ	29,820 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD	Vertisockets™ 800	Active	Bulk	-	Through Hole, Right Angle, Horizontal	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Phosphor Bronze

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Electronic Components Recycling