9 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$31.32
RFQ
42,260
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) Gold 34 (2 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$30.60
RFQ
71,940
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) Gold 34 (2 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$30.60
RFQ
18,820
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) Gold 34 (2 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$6.85
RFQ
54,800
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.85
RFQ
30,660
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$6.85
RFQ
55,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$7.48
RFQ
58,900
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 34 (2 x 17) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$7.48
RFQ
62,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 34POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 34 (2 x 17) Beryllium Copper 10.0µin (0.25µm) Brass
714-43-234-31-018000
Per Unit
$4.08
RFQ
56,660
One step to sell excess stocks.Or submit Qty to get quotes
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 34POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 34 (2 x 17) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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