Sockets for ICs, Transistors - EGchip

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4 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	100-020-001		GET PRICE	PDF RFQ	60,380 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 20POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Closed Frame, Seal Tape	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	20 (2 x 10)	Beryllium Copper	Flash	Brass
	100-020-000		GET PRICE	PDF RFQ	45,620 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 20POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	20 (2 x 10)	Beryllium Copper	Flash	Brass
	100-020-051		GET PRICE	PDF RFQ	13,280 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 20POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Closed Frame, Seal Tape	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	20 (2 x 10)	Beryllium Copper	Flash	Brass
	100-020-050		GET PRICE	PDF RFQ	63,080 One step to sell excess stocks.Or submit Qty to get quotes	3M	CONN IC DIP SOCKET 20POS GOLD	100	Obsolete	Bulk	-65°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	20 (2 x 10)	Beryllium Copper	Flash	Brass

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Semi & E-assets with higher price!

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Electronic Components Recycling