- Series :
- Part Status :
- Operating Temperature :
- Mounting Type :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
13 products
IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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27,920
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|
Samtec Inc. | CONN ADAPTER PLUG 28POS GOLD | APA | Active | Bulk | - | Through Hole | Solder | Open Frame | - | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 20.0µin (0.51µm) | Phosphor Bronze | ||||
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59,280
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | - | - | - | |||
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77,700
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|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
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65,280
One step to sell excess stocks.Or submit Qty to get quotes
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
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58,400
One step to sell excess stocks.Or submit Qty to get quotes
|
On Shore Technology Inc. | CONN IC DIP SOCKET 28POS GOLD | BU-178HT | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Copper | 28 (2 x 14) | Beryllium Copper | Flash | Brass | ||||
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74,320
One step to sell excess stocks.Or submit Qty to get quotes
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 28POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
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13,420
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
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18,480
One step to sell excess stocks.Or submit Qty to get quotes
|
CNC Tech | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | ||||
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34,000
One step to sell excess stocks.Or submit Qty to get quotes
|
CNC Tech | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | ||||
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64,800
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | 28P,DIP SKT,600 CL,LDR,PB FREE | Diplomate DL | Active | Bulk | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | Nickel | ||||
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55,880
One step to sell excess stocks.Or submit Qty to get quotes
|
CNC Tech | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 100.0µin (2.54µm) | Phosphor Bronze | ||||
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46,960
One step to sell excess stocks.Or submit Qty to get quotes
|
On Shore Technology Inc. | CONN IC DIP SOCKET 28POS TIN | ED | Active | Tube | -55°C ~ 110°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | ||||
|
71,660
One step to sell excess stocks.Or submit Qty to get quotes
|
On Shore Technology Inc. | CONN IC DIP SOCKET 28POS TIN | ED | Active | Tube | -55°C ~ 110°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze |