5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$1.35
RFQ
64,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.68
RFQ
13,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.86
RFQ
47,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.11
RFQ
63,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.23
RFQ
28,580
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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