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32 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
Default Photo
36-6553-16
Per Unit
$19.52
RFQ
76,700
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
36-6552-16
Per Unit
$19.52
RFQ
76,960
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-6551-16
Per Unit
$19.52
RFQ
38,380
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-3553-16
Per Unit
$19.52
RFQ
65,100
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-3551-16
Per Unit
$19.52
RFQ
15,240
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-6551-18
Per Unit
$37.09
RFQ
75,080
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
36-3553-18
Per Unit
$37.09
RFQ
26,640
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
36-3552-18
Per Unit
$37.09
RFQ
60,700
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
36-3551-18
Per Unit
$37.09
RFQ
20,280
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
36-6552-18
Per Unit
$37.09
RFQ
20,320
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
32-6553-18
Per Unit
$35.06
RFQ
32,740
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-6554-16
Per Unit
$21.43
RFQ
32,600
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-3554-16
Per Unit
$21.43
RFQ
70,520
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-3552-16
Per Unit
$21.43
RFQ
47,320
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-6554-18
Per Unit
$40.73
RFQ
65,180
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
36-3554-18
Per Unit
$40.73
RFQ
78,720
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
Default Photo
36-6554-11
Per Unit
$8.43
RFQ
26,160
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-3554-11
Per Unit
$8.43
RFQ
47,520
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-3552-11
Per Unit
$8.43
RFQ
68,680
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-6553-11
Per Unit
$7.58
RFQ
43,920
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-6552-11
Per Unit
$7.58
RFQ
39,420
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-6551-11
Per Unit
$7.58
RFQ
35,360
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-3553-11
Per Unit
$7.58
RFQ
60,860
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-3551-11
Per Unit
$7.58
RFQ
60,140
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-6553-10
Per Unit
$5.71
RFQ
67,000
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
Default Photo
36-6552-10
Per Unit
$5.71
RFQ
52,300
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-6551-10
Per Unit
$5.71
RFQ
39,680
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-3553-10
Per Unit
$5.71
RFQ
15,840
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-3551-10
Per Unit
$5.71
RFQ
24,900
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper
Default Photo
36-6554-10
Per Unit
$6.36
RFQ
69,200
One step to sell excess stocks.Or submit Qty to get quotes
 Aries Electronics CONN IC DIP SOCKET ZIF 36POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper
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