5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$0.79
RFQ
14,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.90
RFQ
29,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (1 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.06
RFQ
69,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (1 x 8) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.47
RFQ
65,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.58
RFQ
32,560
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Page 1 / 1