5 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$1.39
RFQ
62,460
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 18POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.59
RFQ
70,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 18POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.00
RFQ
76,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 18POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.90
RFQ
73,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 18POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.22
RFQ
48,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET SIP 18POS GOLD 0513 Active Bulk Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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