Contact Finish - Mating :
179 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$17.34
RFQ
18,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
14,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
25,720
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
18,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$17.34
RFQ
59,920
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
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RFQ
43,660
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3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
Default Photo
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RFQ
68,800
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN IC DIP SOCKET 32POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) 32 (2 x 16) Beryllium Copper Flash Brass
Default Photo
Per Unit
$31.84
RFQ
74,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$14.79
RFQ
79,820
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$14.58
RFQ
35,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$17.59
RFQ
48,440
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$17.59
RFQ
38,940
One step to sell excess stocks.Or submit Qty to get quotes
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
79,540
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
22,560
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
70,580
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$9.05
RFQ
71,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
75,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
35,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
29,480
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$8.97
RFQ
73,300
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$15.35
RFQ
58,920
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$15.30
RFQ
76,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.30
RFQ
55,400
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$15.30
RFQ
70,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$8.39
RFQ
55,480
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$8.39
RFQ
51,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$11.44
RFQ
30,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.44
RFQ
77,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$7.93
RFQ
26,120
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$7.93
RFQ
46,180
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 32POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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