Contact Finish Thickness - Mating :
Contact Finish - Post :
Contact Material - Post :
2075 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
76,700
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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RFQ
29,040
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
28-516-10
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RFQ
52,880
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
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RFQ
38,540
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
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RFQ
68,680
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Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$26.99
RFQ
77,480
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$26.51
RFQ
29,560
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Aries Electronics CONN SOCKET PGA GOLD PG Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$17.20
RFQ
43,780
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$17.20
RFQ
14,820
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$31.81
RFQ
23,840
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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RFQ
19,720
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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RFQ
17,220
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Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Obsolete Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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RFQ
76,360
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Aries Electronics CONN IC DIP SOCKET 60POS GOLD 518 Obsolete Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 60 (2 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$14.52
RFQ
42,080
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$14.37
RFQ
74,800
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$23.43
RFQ
48,200
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$23.43
RFQ
33,300
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$22.14
RFQ
34,100
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$28.63
RFQ
33,380
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Aries Electronics CONN SOCKET PGA GOLD PGG Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$12.71
RFQ
29,120
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$12.71
RFQ
38,160
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
Default Photo
Per Unit
$11.40
RFQ
71,980
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$11.40
RFQ
27,140
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
39,460
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
20,800
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
42,700
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
76,840
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.40
RFQ
16,240
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$11.38
RFQ
28,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$18.35
RFQ
14,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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