Sockets for ICs, Transistors - EGchip

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10 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	32-1508-31	Per Unit $7.55		PDF RFQ	59,180 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	32 (2 x 16)	Beryllium Copper	10.0µin (0.25µm)	Brass
	32-1508-21	Per Unit $7.55		PDF RFQ	14,240 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	32 (2 x 16)	Beryllium Copper	10.0µin (0.25µm)	Brass
	32-1518-11	Per Unit $2.18		PDF RFQ	19,560 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	32 (2 x 16)	Beryllium Copper	10.0µin (0.25µm)	Brass
	32-1518-11H	Per Unit $3.57		PDF RFQ	27,840 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	32 (2 x 16)	Beryllium Copper	10.0µin (0.25µm)	Brass
	32-1508-30	Per Unit $4.86		PDF RFQ	74,540 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-1508-20	Per Unit $4.86		PDF RFQ	24,320 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	508	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-1518-10T	Per Unit $1.64		PDF RFQ	67,680 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-1518-10	Per Unit $1.50		PDF RFQ	17,400 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-1518-10H	Per Unit $1.80		PDF RFQ	53,720 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass
	32-1518-00	Per Unit $3.10		PDF RFQ	13,940 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)	Brass

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Electronic Components Recycling