11 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$1.49
RFQ
27,920
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$0.76
RFQ
66,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.59
RFQ
15,680
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.50
RFQ
43,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.49
RFQ
47,040
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$0.85
RFQ
58,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.02
RFQ
49,560
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.90
RFQ
49,020
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.27
RFQ
73,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.22
RFQ
51,800
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.20
RFQ
67,360
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
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