- Operating Temperature :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Post :
45 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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19,100
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 400 (20 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
|
76,840
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
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|
16,240
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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34,380
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 1207POS GOLD | - | Active | Tray | -55°C ~ 110°C | Surface Mount | Solder | Closed Frame | LGA | Thermoplastic | 0.043" (1.09mm) | Gold | - | - | 1207 (33 x 34) | Beryllium Copper | - | - | |||
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52,340
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 1207POS GOLD | - | Active | Tray | -55°C ~ 110°C | Surface Mount | Solder | Closed Frame | LGA | Thermoplastic | 0.043" (1.09mm) | Gold | - | - | 1207 (33 x 34) | Beryllium Copper | - | - | |||
|
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64,420
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
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17,880
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
77,500
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET BGA 400POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 400 (20 x 20) | Beryllium Copper | - | Brass | |||
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53,080
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET PGA 256POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 256 (16 x 16) | Beryllium Copper | Flash | Brass | |||
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|
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14,020
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET BGA 400POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 400 (20 x 20) | Beryllium Copper | - | Brass | |||
|
|
|
17,760
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
71,720
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
14,840
One step to sell excess stocks.Or submit Qty to get quotes
|
Samtec Inc. | CONN SOCKET PLCC 44POS GOLD | PLCC | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Liquid Crystal Polymer (LCP) | 0.050" (1.27mm) | Gold | Flash | Tin | 44 (4 x 11) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
76,820
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
22,620
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
39,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
15,940
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
64,800
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
|
33,680
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET PGA 144POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 144 (12 x 12) | Beryllium Copper | - | Brass | |||
|
|
|
47,360
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
73,620
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
47,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
13,380
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
14,400
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
64,280
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
32,240
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN TRANSIST TO-5 4POS GOLD | 917 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | Transistor, TO-5 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Gold | 30.0µin (0.76µm) | Tin | 4 (Round) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
71,060
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN TRANSIST TO-5 3POS GOLD | 917 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | Transistor, TO-5 | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Gold | 30.0µin (0.76µm) | Tin | 3 (Round) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
48,960
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN SOCKET PGA 144POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 144 (12 x 12) | Beryllium Copper | - | Brass | |||
|
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|
44,780
One step to sell excess stocks.Or submit Qty to get quotes
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
|
65,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Surface Mount | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass |
