- Part Status :
- Operating Temperature :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6, Glass Filled (28)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (10)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
- Polyester (1)
- Polyethersulfone (PES), Glass Filled (2)
- Polyphenylene Sulfide (PPS), Glass Filled (21)
- Thermoplastic, Glass Filled (3)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Post :
69 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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65,040
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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GET PRICE |
57,060
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||
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70,340
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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40,480
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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44,720
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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55,560
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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76,200
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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12,900
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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50,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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44,940
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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17,140
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
|
77,020
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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60,980
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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14,740
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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74,180
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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25,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
21,680
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
21,700
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
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|
16,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
40,440
One step to sell excess stocks.Or submit Qty to get quotes
|
Preci-Dip | CONN IC DIP SOCKET 28POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
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|
|
52,280
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
|
34,040
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
39,420
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
|
30,960
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
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|
|
20,740
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
66,140
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
19,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
44,580
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
22,800
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
|
64,600
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass |
