Contact Finish - Mating :
Contact Finish - Post :
Contact Finish Thickness - Post :
134 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
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RFQ
30,940
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
2-640361-4
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RFQ
65,700
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 24 (2 x 12) Beryllium Copper 15.0µin (0.38µm) Beryllium Copper
24-516-10
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RFQ
38,540
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$36.67
RFQ
50,460
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$36.67
RFQ
35,060
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$35.26
RFQ
68,740
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$35.26
RFQ
46,360
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
1-1825094-7
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RFQ
40,360
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
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RFQ
27,220
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$18.45
RFQ
73,400
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$15.31
RFQ
79,640
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$15.31
RFQ
60,260
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$15.31
RFQ
20,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$15.31
RFQ
43,160
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$15.31
RFQ
29,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
Per Unit
$15.31
RFQ
76,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 24 (2 x 12) Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
Default Photo
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RFQ
12,280
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
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RFQ
24,940
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
Default Photo
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RFQ
30,300
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 24 (2 x 12) Beryllium Copper Flash Nickel
4-1571551-8
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RFQ
71,140
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Nickel
Default Photo
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RFQ
58,560
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash - 24 (2 x 12) Beryllium Copper - Brass
Default Photo
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RFQ
55,000
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 24 (2 x 12) Beryllium Copper - Brass
Default Photo
Per Unit
$7.96
RFQ
51,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$7.96
RFQ
56,600
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$7.96
RFQ
73,080
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$7.96
RFQ
76,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$7.96
RFQ
30,740
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$7.96
RFQ
67,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$7.96
RFQ
52,340
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
Per Unit
$7.96
RFQ
15,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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