- Series :
-
- - (377)
- 100 (7)
- 101 (2)
- 110 (64)
- 111 (7)
- 114 (15)
- 115 (25)
- 116 (87)
- 117 (4)
- 123 (1)
- 210 (10)
- 214 (2)
- 299 (12)
- 410 (4)
- 500 (11)
- 516 (4)
- 518 (43)
- 55 (26)
- 57 (32)
- 612 (6)
- 614 (18)
- 6556 (2)
- 700 (1)
- 714 (1)
- 8 (26)
- 800 (9)
- BU-178HT (1)
- Correct-A-Chip® 1109800 (1)
- D2 (2)
- D39 (1)
- D95 (3)
- Diplomate DL (9)
- EJECT-A-DIP™ (11)
- ICA (2)
- ICO (2)
- Lo-PRO®file, 513 (10)
- Lo-PRO®file, 526 (2)
- SA (4)
- Textool™ (1)
- Vertisockets™ 800 (6)
- WMS (2)
- XR2 (6)
- Part Status :
- Packaging :
- Operating Temperature :
- Features :
- Type :
-
- DIP, 0.1" (2.54mm) Row Spacing (1)
- DIP, 0.2" (5.08mm) Row Spacing (6)
- DIP, 0.3" (7.62mm) Row Spacing (158)
- DIP, 0.4" (10.16mm) Row Spacing (77)
- DIP, 0.6" (15.24mm) Row Spacing (192)
- DIP, ZIF (ZIP) (6)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (30)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (28)
- SOIC (1)
- Zig-Zag, Left Stackable (2)
- Zig-Zag, Right Stackable (2)
- Housing Material :
-
- Aluminum Alloy (1)
- Plastic (2)
- Polyamide (PA46), Nylon 4/6, Glass Filled (103)
- Polybutylene Terephthalate (PBT) (3)
- Polybutylene Terephthalate (PBT), Glass Filled (8)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (112)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (163)
- Polyester (2)
- Polyester, Glass Filled (4)
- Polyethersulfone (PES), Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (67)
- Thermoplastic (7)
- Thermoplastic, Glass Filled (4)
- Thermoplastic, Polyester (12)
- Thermoplastic, Polyester, Glass Filled (4)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
503 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
GET PRICE |
30,940
One step to sell excess stocks.Or submit Qty to get quotes
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||
|
|
GET PRICE |
59,340
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
|
GET PRICE |
65,700
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 24 (2 x 12) | Beryllium Copper | 15.0µin (0.38µm) | Beryllium Copper | ||
|
|
GET PRICE |
38,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||
|
|
|
GET PRICE |
70,260
One step to sell excess stocks.Or submit Qty to get quotes
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||
|
|
|
GET PRICE |
24,980
One step to sell excess stocks.Or submit Qty to get quotes
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||
|
|
|
GET PRICE |
22,600
One step to sell excess stocks.Or submit Qty to get quotes
|
Amphenol FCI | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||
|
|
|
GET PRICE |
18,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||
|
|
|
GET PRICE |
43,600
One step to sell excess stocks.Or submit Qty to get quotes
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||
|
|
|
GET PRICE |
47,460
One step to sell excess stocks.Or submit Qty to get quotes
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||
|
|
GET PRICE |
47,500
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||
|
|
|
GET PRICE |
62,440
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 24 (2 x 12) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | ||
|
|
|
50,460
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
35,060
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
68,740
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
46,360
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
GET PRICE |
41,080
One step to sell excess stocks.Or submit Qty to get quotes
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||
|
|
|
GET PRICE |
39,700
One step to sell excess stocks.Or submit Qty to get quotes
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||
|
|
GET PRICE |
40,360
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||
|
|
GET PRICE |
40,120
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
|
GET PRICE |
45,720
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
|
GET PRICE |
15,380
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
|
GET PRICE |
79,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
|
|
GET PRICE |
27,220
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||
|
|
GET PRICE |
51,840
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||
|
|
GET PRICE |
40,440
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 24 (2 x 12) | Beryllium Copper | - | Beryllium Copper | ||
|
|
|
GET PRICE |
34,680
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||
|
|
|
73,400
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 24 (2 x 12) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
|
79,640
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 24 (2 x 12) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
|
60,260
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 24 (2 x 12) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper |
