67 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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RFQ
38,480
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Beryllium Copper
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RFQ
57,280
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 40 (2 x 20) Beryllium Copper 29.5µin (0.75µm) Beryllium Copper
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RFQ
16,780
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 24 (2 x 12) Beryllium Copper 29.5µin (0.75µm) Beryllium Copper
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RFQ
41,520
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C - Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 32 (1 x 32) Beryllium Copper - Beryllium Copper
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RFQ
65,220
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Omron Electronics Inc-EMC Div CONN IC SOCKET 20POS XR2 Obsolete Bulk -55°C ~ 125°C - Solder Closed Frame Housing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) - - - 20 (1 x 20) Beryllium Copper - Beryllium Copper
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RFQ
47,800
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$3.31
RFQ
77,700
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$2.25
RFQ
78,540
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (1 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$2.17
RFQ
65,280
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 28POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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Per Unit
$1.48
RFQ
60,520
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
BU280Z-178-HT
Per Unit
$1.44
RFQ
58,400
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On Shore Technology Inc. CONN IC DIP SOCKET 28POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 28 (2 x 14) Beryllium Copper Flash Brass
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Per Unit
$1.35
RFQ
43,760
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 16 (2 x 8) Beryllium Copper Flash Beryllium Copper
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Per Unit
$1.34
RFQ
78,840
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 16 (2 x 8) Beryllium Copper Flash Beryllium Copper
BU480Z-178-HT
Per Unit
$3.48
RFQ
18,500
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On Shore Technology Inc. CONN IC DIP SOCKET 48POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 48 (2 x 24) Beryllium Copper Flash Brass
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Per Unit
$0.27
RFQ
23,760
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 10POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper Flash Brass
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Per Unit
$0.26
RFQ
50,160
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN SOCKET SIP 13POS GOLD SBU Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
Per Unit
$0.24
RFQ
13,120
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 10POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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Per Unit
$2.66
RFQ
24,420
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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Per Unit
$2.60
RFQ
56,480
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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Per Unit
$2.54
RFQ
69,180
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.51
RFQ
77,260
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
Per Unit
$2.43
RFQ
51,700
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
BU400Z-178-HT
Per Unit
$3.49
RFQ
24,940
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 40POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 40 (2 x 20) Beryllium Copper Flash Brass
XR2A-2411-N
Per Unit
$1.75
RFQ
76,380
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
BU200Z-178-HT
Per Unit
$1.60
RFQ
69,140
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 20POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 20 (2 x 10) Beryllium Copper Flash Brass
BU240Z-178-HT
Per Unit
$1.48
RFQ
69,360
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 24POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 24 (2 x 12) Beryllium Copper Flash Brass
BU160Z-178-HT
Per Unit
$1.18
RFQ
66,760
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 16POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 16 (2 x 8) Beryllium Copper Flash Brass
BU060Z-178-HT
Per Unit
$0.56
RFQ
45,100
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 6POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 6 (2 x 3) Beryllium Copper Flash Brass
BU080Z-178-HT
Per Unit
$1.07
RFQ
28,920
One step to sell excess stocks.Or submit Qty to get quotes
On Shore Technology Inc. CONN IC DIP SOCKET 8POS GOLD BU-178HT Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 78.7µin (2.00µm) Copper 8 (2 x 4) Beryllium Copper Flash Brass
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Per Unit
$2.85
RFQ
39,220
One step to sell excess stocks.Or submit Qty to get quotes
Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 24POS GOLD XR2 Active Bulk -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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