Packaging :
Contact Finish - Mating :
6 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$0.27
RFQ
23,760
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 10POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash 10 (2 x 5) Beryllium Copper Flash Brass
Default Photo
Per Unit
$0.24
RFQ
13,120
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 10POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$0.40
RFQ
13,420
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$0.69
RFQ
67,100
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$0.63
RFQ
46,900
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 4POS TIN - Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
Per Unit
$0.58
RFQ
71,780
One step to sell excess stocks.Or submit Qty to get quotes
Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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