Sockets for ICs, Transistors - EGchip

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9 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
	28-3554-16	Per Unit $18.45		PDF RFQ	73,400 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-3553-16	Per Unit $15.31		PDF RFQ	79,640 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-6553-16	Per Unit $15.31		PDF RFQ	60,260 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-6552-16	Per Unit $15.31		PDF RFQ	20,320 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-6551-16	Per Unit $15.31		PDF RFQ	43,160 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-3552-16	Per Unit $15.31		PDF RFQ	29,740 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-3551-16	Per Unit $15.31		PDF RFQ	76,880 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-3554-16	Per Unit $16.45		PDF RFQ	26,280 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper
	24-6554-16	Per Unit $17.02		PDF RFQ	35,260 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET ZIF 24POS	55	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	24 (2 x 12)	Beryllium Copper

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Electronic Components Recycling