- Part Status :
- Operating Temperature :
- Features :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6, Glass Filled (2)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (8)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (1)
- Polyester, Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (32)
- Thermoplastic (2)
- Thermoplastic, Polyester (2)
- Contact Finish Thickness - Mating :
- Contact Material - Post :
49 products
| IMAGE | PART NO. | PRICE (reference only) | QUANTITY | STOCK | Mfr. | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
59,340
One step to sell excess stocks.Or submit Qty to get quotes
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||
|
|
GET PRICE |
38,540
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||
|
|
GET PRICE |
22,600
One step to sell excess stocks.Or submit Qty to get quotes
|
Amphenol FCI | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||
|
|
|
50,460
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
35,060
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
68,740
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
46,360
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
GET PRICE |
40,440
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Beryllium Copper | ||
|
|
|
GET PRICE |
37,260
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Copper | ||
|
|
|
GET PRICE |
29,680
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Beryllium Copper | ||
|
|
|
51,780
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
56,600
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
67,140
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
68,940
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
75,920
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
20,020
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
61,680
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
16,300
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
13,320
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
68,240
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
47,660
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
12,360
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
36,940
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
68,260
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
69,540
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Beryllium Copper | |||
|
|
|
71,540
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Copper | |||
|
|
|
15,460
One step to sell excess stocks.Or submit Qty to get quotes
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Nickel | |||
|
|
|
43,900
One step to sell excess stocks.Or submit Qty to get quotes
|
Samtec Inc. | CONN IC DIP SOCKET 24POS TIN | ICA | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Beryllium Copper | - | Brass | |||
|
|
44,220
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
|
44,700
One step to sell excess stocks.Or submit Qty to get quotes
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper |
