37 products
IMAGE PART NO. PRICE (reference only) QUANTITY STOCK Mfr. DESCRIPTION Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
Default Photo
Per Unit
$8.52
RFQ
39,260
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.34
RFQ
51,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.16
RFQ
26,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.14
RFQ
51,860
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.48
RFQ
36,340
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.45
RFQ
58,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.33
RFQ
37,280
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.69
RFQ
60,520
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$5.97
RFQ
30,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.97
RFQ
69,140
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.97
RFQ
37,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.97
RFQ
36,780
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.97
RFQ
66,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$5.97
RFQ
32,320
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 8 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame, Elevated DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.61
RFQ
74,880
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$4.80
RFQ
33,660
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.80
RFQ
51,420
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.80
RFQ
25,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$4.80
RFQ
27,040
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$3.80
RFQ
75,900
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$2.58
RFQ
12,980
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.47
RFQ
39,960
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$3.66
RFQ
26,760
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.66
RFQ
58,500
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.60
RFQ
58,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.82
RFQ
16,380
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$2.72
RFQ
35,840
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.53
RFQ
31,080
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
Per Unit
$1.49
RFQ
75,800
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
Per Unit
$1.11
RFQ
50,240
One step to sell excess stocks.Or submit Qty to get quotes
Aries Electronics CONN IC DIP SOCKET 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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