Sockets for ICs, Transistors - EGchip

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6 products

IMAGE	PART NO.	PRICE (reference only)	QUANTITY		STOCK	Mfr.	DESCRIPTION	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
	22-1518-00	Per Unit $2.14		PDF RFQ	51,860 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-1518-11H	Per Unit $2.72		PDF RFQ	35,840 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-1518-11	Per Unit $1.53		PDF RFQ	31,080 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-1518-10	Per Unit $1.05		PDF RFQ	20,700 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-1518-10T	Per Unit $1.02		PDF RFQ	57,880 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-1518-10H	Per Unit $1.24		PDF RFQ	19,160 One step to sell excess stocks.Or submit Qty to get quotes	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD	518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass

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Electronic Components Recycling